Kezuru - DISCO
2019-12-23 · Wafer thickness: 100 µm Feed speed: 140 mm/s 1 pass Wafer thickness: 200 µm Wafer thickness: 120 µm Feed speed: 600 mm/s π cut Wafer thickness: 100 µm Wafer thickness: 150 µm Wafer thickness: 350 µm Wafer thickness: 700 µm Cu-Mo-Cu Grooving Full cut Sapphire Wafer thickness: 150 µm Scribing Kiru Kiru Kiru Kezuru Migaku Laser Saw Short ...
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